Finite Element Analysis (FEA) has emerged as an indispensable tool in the study and design of power cables and submarine cable systems. By subdividing complex cable assemblies into discrete, ...

A team of researchers, including Insigneo member Professor Damien Lacroix from the University of Sheffield’s Department of Mechanical Engineering, have published a paper in Frontiers in Surgery.

In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

This is a preview. Log in through your library . Abstract Very few finite element head models have been validated as required before being used to study brain injury mechanisms. This paper deals with ...

AxisVM is a high-quality software package for civil engineers. It is a useful tool for engineers in numerous countries. Users can build the 3D model with the aid of integrated visual modeling and ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Figure 1: View of Global Finite Element Tug Model. Figure 2: Refined Structure in Way of Load Box. Figure 3: Load Application. Figure 4: ABS Load Box Yielding Evaluation Plot. Figure 5: Color Coded ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...