Electronics components are steadily moving away from through hole parts to using surface mount technology (SMT) exclusively. While the small size of the SMT components can be intimidating, with a ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

This FAQ will look at how a PC board loaded with anywhere from just a few to hundreds of components is soldered in one smooth process, and the fascinating technology and systems it takes to do that.

Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...

This application note provides an in-depth discussion of the soldering process and how it relates to leaded LED lamps and display components, with the objective of serving as a guide to achieving high ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...

Soldering uses alloys that melt below 840°F to join metals. Molten solder fills the space between surfaces to be joined, adheres to the surfaces, and solidifies. Typical soldering steps include: ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...