A research team has successfully developed a new approach to create switchable magnetic materials by using hydrogen bonding at the molecular level. This groundbreaking study shows how certain metal ...
Research suggests some metals’ semicore electrons may be more active on Earth’s surface than previously thought.
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
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