EV Group, a developer of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is partnering with DELO, amanufacturer of industrial adhesives, specified for ...
FLORIAN, Austria and WINDACH, Germany, Nov. 11, 2019 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor ...
Manufacturing thousands of lenses on a wafer will reduce the size and cost of camera modules for mobile applications. Tessera's new OptiML Wafer Level Camera (WLC) process is able to manufacture ...
The cutting-edge e-beam evaporation system accelerates the customer's development program in several ways. “First, it processes 200 mm wafers, facilitating work on production-scale product,” explains ...
Fabless semiconductor company Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources (via DigiTimes). The solution is ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...
SAN JOSE, Calif. – Tessera Technologies Inc. has scrapped further development of its wafer-level optics line for camera modules. In connection with the cessation of the development of wafer-level ...
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...
In all the discussion about the commercial viability of imprint, a manufacturing line has been quietly put in place to imprint lenses of cell phone camera chips. The company leading these developments ...
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