Proceedings of the National Academy of Sciences of the United States of America, Vol. 4, No. 8 (Aug. 15, 1918), pp. 236-241 (6 pages) ...
Fracture and breakage of single crystals, particularly of silicon wafers, are multi-scale problems: the crack tip starts propagating on an atomic scale with the breaking of chemical bonds, forms crack ...
“X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been ...
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