AMD CTO Mark Papermaster discusses holistic design, domain-specific chiplets, and trusted AI infrastructure at World Summit AI 2026.
From electrification to software-defined vehicles, automotive innovation is driving new requirements for semiconductor packaging and test.
Track energized compute, not gigawatts, as AI data centers face delays in memory, networking, cooling, and power.
Axelera AI Co-Founder and CEO Fabrizio Del Maffeo outlines the three walls holding back physical AI—power, economics, and ...
Solve 13.56 MHz NFC antenna integration challenges with expert engineering solutions for metal shielding, placement limits, and chipset matching.
Broader adoption of the electric car will depend on innovations that address cost, charging and everyday practicality.
Everspin’s CXL-connected MRAM creates a persistent memory tier between DRAM and NAND for latency-sensitive AI workloads.
Emergence AI brings neuroformal AI to semiconductor manufacturing and yield analysis, combining LLMs with symbolic reasoning ...
Europe's strategic space independence will depend on semiconductor supply chains, satellite networks, and 6G communications.
Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs.
At AutoSens Europe, automotive sensing designs reflected tighter safety standards, AI advances, and cybersecurity ...
Synopsys joins OpenAI for a leap of faith in AI-native IC design by augmenting frontier models with EDA tools.
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